All items written by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

October 19, 2022 by Cristina Costa

Microchip Announces New Arm-Based PIC with Built-in Bluetooth Low Energy Connectivity

Microchip Technology introduced its first Arm Cortex-M4F-based PIC microcontroller (MCU) family that solves basic wireless connectivity design challenges by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components, supported by one of the industry’s most comprehensive developer ecosystems. Microchip's new PIC32CX-BZ2 MCU family is available in SoCs QFN packages and complete PCB modules and antenna.

OKdo Announces Partnership to Supply Single Board Computers and System on Modules

August 23, 2022 by Cristina Costa

OKdo Announces Partnership to Supply Single Board Computers and System on Modules

OKdo, the company that is part of RS Group, one of the largest global electronics omni-channel distributors, announced an exclusive partnership with Radxa, a leading design service provider, to manufacture and distribute ROCK Single Board Computers (SBCs) and ROCK System-on-Modules (SoMs). With the announcement, OKdo pivots its strategy to offer a powerful solution to the ongoing supply chain crisis to the engineering community.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

July 21, 2022 by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.

Infineon Launches Industry’s First Battery-Powered AI/ML-Based Acoustic Event Detection and Sensor Fusion Alarm System

July 5, 2022 by Cristina Costa

Infineon Launches Industry’s First Battery-Powered AI/ML-Based Acoustic Event Detection and Sensor Fusion Alarm System

Infineon Technologies introduced its battery-powered Smart Alarm System (SAS), a technology platform that achieves high accuracy and very low-power operation using sensor fusion based on artificial intelligence/machine learning (AI/ML). This technology combined with low-power wake-on acoustic event detection allows compact designs that exceed the detection accuracy of acoustic-only alarm systems used today.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors

June 20, 2022 by Cristina Costa

New STMicroelectronics Smart Inertial Modules Bring AI To Remote Sensors

STMicroelectronics has introduced new inertial sensors that contain the intelligent sensor processing unit (ISPU) to power applications interacting with trained devices, allowing intelligence moving from “on” the edge to “in” the edge. The sensor's on-chip signal processing core, programmable with ST’s NanoEdge AI Studio, is ideal for machine-learning applications.

Tektronix 2 Series Mixed Signal Oscilloscope Reimagines Performance and Portability

June 17, 2022 by Cristina Costa

Tektronix 2 Series Mixed Signal Oscilloscope Reimagines Performance and Portability

Tektronix unveiled the 2 Series Mixed Signal Oscilloscope (MSO), reimagining what is possible in test and measurement. The new 2 Series MSO can go seamlessly from the bench to the field and back, enabling workflows previously unimagined on a scope. It is the first portable oscilloscope to offer benchtop performance with a familiar Tektronix user interface. Weighing less than 1.8kgs and 38mm thin, the 2 Series MSO can fit into a small backpack, delivering unmatched performance and portability.

Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices

June 14, 2022 by Cristina Costa

Metalenz and STMicroelectronics Deliver World's First Optical Metasurface Technology for Consumer Electronics Devices

Metalenz, the first company to commercialize meta-optics, and STMicroelectronics announced that ST’s currently released VL53L8 direct Time-of-Flight (dToF) sensor is the highly anticipated market debut of the meta-optics devices developed through their partnership, which was disclosed in June 2021. Metalenz metasurfaces are now on the market, marking the introduction of this revolutionary optical technology in real-world devices.

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

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