All items in category Electronics Corner
Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference
by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.
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OKdo Announces Partnership to Supply Single Board Computers and System on Modules
by Cristina Costa

OKdo Announces Partnership to Supply Single Board Computers and System on Modules

OKdo, the company that is part of RS Group, one of the largest global electronics omni-channel distributors, announced an exclusive partnership with Radxa, a leading design service provider, to manufacture and distribute ROCK Single Board Computers (SBCs) and ROCK System-on-Modules (SoMs). With the announcement, OKdo pivots its strategy to offer a powerful solution to the ongoing supply chain crisis to the engineering community.
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Linear Systems Announces LSK489 Premier Performance JFET Re-Release
by audioXpress Staff

Linear Systems Announces LSK489 Premier Performance JFET Re-Release

Linear Integrated Systems, the world class producer of ultra-low-noise JFETS and other small-signal discrete semiconductors, has announced the re-release of its LSK489 discrete component with specialized parameter grading. The LSK489 is one of the world's premier JFETs optimized for use in high-end sensor front-end amplification designs, and the re-release in 2022 introduces improved manufacturing consistency.
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Langer EMV-Technik Announces PA 2522 Compact Preamplifier for Low Signal Measurements from 10MHz up to 22GHz
by audioXpress Staff

Langer EMV-Technik Announces PA 2522 Compact Preamplifier for Low Signal Measurements from 10MHz up to 22GHz

The new PA 2522 preamplifier from Langer EMV-Technik can be used to amplify weak measurement signals from near-field probes, connected to the 50Ω input of a spectrum analyzer or oscilloscope. It stands out because of its low noise behavior and a constantly high dynamic range over an extremely wide frequency range, from 10MHz to 22GHz. The preamplifier is powered by the included power adapter.
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Linear Systems Releases Low-Cost, Low-Noise LS844 JFET for High-Performance Applications
by audioXpress Staff

Linear Systems Releases Low-Cost, Low-Noise LS844 JFET for High-Performance Applications

Linear Systems announced the re-release of the low-noise, low-cost LS844 series dual JFET with immediate large-scale availability and large-volume pricing. The re-released LS844 is the latest evolution of a classic dual JFET developed and introduced by Linear Systems over 20 years ago. The company has refined the part’s design and fabrication processes to improve its low noise, matching and Common Mode Rejection Ratio qualities while retaining the linearity and other characteristics sought by audio and other circuit designers.
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Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC
by Cristina Costa

Big Fish Semiconductor and Dolphin Design Partnership Enables Mass Production for Bluetooth 5.2 Audio SoC

Dolphin Design, an advanced chip design company and leading specialist in Edge Computing and AI platforms, and Big Fish Semiconductor have entered into a long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership. The high-performance recording capabilities of the U2 BLE 5.2 Audio AI SoC are made possible by Dolphin Design's 24-bit delta-sigma audio ADC, which combines superior audio performance, small area and ultra-low power consumption.
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Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth
by audioXpress Staff

Laird Connectivity Launches New SOM that Delivers Powerful NXP Edge Processing with Wi-Fi and Bluetooth

Laird Connectivity announced the new Summit SOM 8M Plus, a highly-integrated and comprehensive hardware and software solution that combines NXP multi-core applications processing with dual-band 2x2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The new system-on-module (SOM) is Laird's most versatile, feature-rich, and secure wireless solution to date, truly perfect for serving as the core platform for advanced connected applications and audio/voice systems.
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Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers
by audioXpress Staff

Keysight Updates PathWave ADS Design and Simulation Software for Radio Frequency and Microwave Designers

Keysight Technologies has introduced the new PathWave Advanced Design System (ADS) 2023, an integrated design and simulation software that rapidly addresses increasing design complexity and higher frequencies in radio frequency (RF) and microwave applications. The updated design and simulation environment includes enhancements to electromagnetic (EM) simulation for circuit designers and streamlines integration of multi-technology circuit assembly and simulation into enterprise electronic design automation (EDA) design workflows.
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Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs
by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.
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Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC
by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.
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