ALL NEWS ITEMS
Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio
Waves Unveils Nx Speakers 3D Audio Technology at CES 2020
Sonarworks Enables Personalized Audio, Perfected for Any Device, with SoundID
Panasonic Shows Strong True Wireless Ambitions at CES 2020
Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio
Shure Unveils New AONIC Line of Wireless Noise-Cancelling Headphones and True Wireless Earphones at CES 2020
Capture All the Excitement of Audio with audioXpress February 2020!
Libre Wireless Technologies Introduces New Universal Wireless Audio Streaming and Multiroom Audio End Point
Cadence Confirms Bluetooth LE Audio LC3 Codec Support for Tensilica HiFi DSPs
Synopsys Announces Bluetooth LE Audio LC3 Codec for ARC Processor