All items tagged with mobile devices (103)

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

December 3, 2020 by Joao Martins

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

Dolby Consumer Survey Reveals New Global Trends in Home Entertainment Consumption and Purchasing

November 25, 2020 by audioXpress Staff

Dolby Consumer Survey Reveals New Global Trends in Home Entertainment Consumption and Purchasing

Dolby Laboratories released findings from a new global survey illustrating a significant shift in consumer entertainment behavior. Findings include new ways of interacting with friends and family while enjoying entertainment, and insights that people are investing more in their home entertainment, looking for enhanced picture or sound quality. From this survey, it remains clear that consumers continue to want, demand, and are willing to spend more on enhanced experiences, now more than ever.

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

November 19, 2020 by Joao Martins

Elliptic Labs Expands its Ultrasound Sensing Framework to More Devices and Mobile Platforms

Norwegian company Elliptic Labs has successfully introduced its ultrasound sensing technology to the market, leveraging early agreements with major chip suppliers to the IT and mobile industries. Following partnerships with Texas Instruments, Infineon, Knowles, Cirrus Logic and AAC Technologies, at the implementation level, Elliptic Labs this year expanded its support directly with chipset manufacturers ARM, Intel, Qualcomm and more recently MediaTek. And the company's efforts in ultrasound-based sensing are just in early stages.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.

AAC Technologies Opens New MEMS Microphone Design Center in Scotland

May 1, 2020 by audioXpress Staff

AAC Technologies Opens New MEMS Microphone Design Center in Scotland

Expanding its commitment to invest in the build-out of a worldwide network of R&D centers that advance the technologies critical to the performance of smartphones and other mobile devices, AAC Technologies Holdings Inc., announced the opening of a MEMS microphone center in Edinburgh, Scotland. The new facility, focused on the design of next generation microphone system-level solutions, joins a growing worldwide network of R&D centers located in China, Denmark, Finland, Hong Kong, Japan, Singapore and the United States.

Dirac Closes $6-Million Financing Round To Boost New Consumer Digital Audio Processing Solution for Headphones and Smartphones

April 14, 2020 by audioXpress Staff

Dirac Closes $6-Million Financing Round To Boost New Consumer Digital Audio Processing Solution for Headphones and Smartphones

Swedish sound pioneer Dirac strengthened its position as a leading one-stop source for digital audio signal processing solutions with the announcement that it has completed a new $6-million (60 MSEK) round of financing. Jonathan Forster, former Spotify executive and current angel investor, joins Dirac’s Board of Directors to help catalyze the company’s expansion into the streaming market and the launch of the company's first consumer-facing product.

Loudspeaker Failures and Protections (Part 1)

February 19, 2020 by Mike Klasco and Steve Tatarunis

Loudspeaker Failures and Protections (Part 1)

A new generation of effective and powerful speaker protection technology, using literally all the capabilities and power of pro sound rackmount loudspeaker management processors, is now being designed into mobile audio products that use very small loudspeakers. The implications are that mobile consumer electronics are going to play louder and sound better than ever. But to optimize speakers this way, we need to understand what causes loudspeakers to fail. This article was published originally in audioXpress, August 2013.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

MWC Barcelona 2020 Cancelled!

January 20, 2020 by audioXpress Staff

MWC Barcelona 2020 Cancelled!

The 2020 edition of the Mobile World Congress (MWC) will take place again in Barcelona, even with all the political instability in the region, with no Uber service, and with all the geo-political pressures against the Chinese telecom giant Huawei, which is a major sponsor of the event. Indifferent to all this, MWC Barcelona 2020 will once again allow a unique perspective on the future of advanced audio applications, smart speakers, voice recognition and, obviously, true wireless earbuds.

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