All items tagged with product development (878)
Simplify Engineering - Building a Collaboration Platform for System Engineers That Specialize in R&D and Manufacturing
December 8, 2022 by Joshua Levy

Simplify Engineering - Building a Collaboration Platform for System Engineers That Specialize in R&D and Manufacturing

I'm a hardware engineer with over ten years of experience, based in Southern California. I've worked on products like the Amazon Alexa and Meta Oculus, and I have grown frustrated with the current processes and inefficiencies of the consumer electronics industry. This is why I created The Lyceum, an online collaborative software that facilitates hardware system engineering research & development and manufacturing by automating data-intensive tasks, keeping a track record of historical technical data, and offering tools for online group work.
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Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio
December 7, 2022 by Joao Martins

Specification Under Development Will Enable LC3plus High-Resolution Codec in Bluetooth LE Audio

The Bluetooth LE Audio set of specifications, introducing the LC3 codec as the mandatory option for wireless audio streaming, is an important evolution compared to the current default SBC codec. Nevertheless, unlike the current Bluetooth Classic A2DP profile that specifies optional audio codecs, LE Audio didn't offer any options. A recent article in the Fraunhofer IIS blog confirms that a new specification is under development to allow support for the LC3plus high-resolution audio codec.
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Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module
November 25, 2022 by audioXpress Staff

Synaptics Launches KatanaConnect Miniature Wireless AI Vision and Audio Module

Synaptics launched an interesting new AI System on Module (SoM) at electronica 2022. KatanaConnect combines the Katana low-power Edge AI SoC with Wi-Fi / Bluetooth wireless connectivity in an ultra-small-form-factor package to deliver AI-enabled computer vision and audio sensing capabilities. The SoM, developed with leading module vendor AMPAK, is a ready-to-use solution that enables rapid implementation of AI sensing features for connected designs targeting a range of applications, including smart home and security, and many others.
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Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs
November 22, 2022 by Cristina Costa

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.
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Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets
November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.
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Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products
November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.
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CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs
November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.
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Highly Anticipated Return for electronica 2022, November 15 to 18
November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.
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Voice Control for Low Power Microcontrollers
November 3, 2022 by Ido Gus

Voice Control for Low Power Microcontrollers

Ido Gus, Deep Learning Senior Team Leader at CEVA’s Sensor and Audio Business Unit, writes about voice control deployment on low power and resource constrained microcontroller-units (MCUs). The article discusses what to consider for the development of products using voice as a primary human interface, and how speech recognition models using AI technology can support a wide variety of use cases and languages, without compromising on power requirements.
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Why Buy Four Chips if You Only Need One?
November 1, 2022 by Special Content

Why Buy Four Chips if You Only Need One?

Azoteq recently expanded its offering to the TWS market with the release of the IQS323. The IQS323 offers capacitive and inductive sensing as user interface and in-ear-detection, whilst the IQS7222A IC is a multifunctional capacitive, inductive, and Hall-effect sensor with additional temperature sensing for reference tracking. The IQS7222A is offered in a 1.62 x 1.62mm WLCSP and allows you to add a touch-and-swipe interface, wear detection, docking detection and your choice of an inductive waterproof button or the inductive force-sensing features.
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