All items tagged with product development (878)

STMicroelectronics Upgrades NanoEdge AI Studio to Streamline Machine-Learning Software Development for Connected Devices

December 1, 2021 by audioXpress Staff

STMicroelectronics Upgrades NanoEdge AI Studio to Streamline Machine-Learning Software Development for Connected Devices

Global semiconductor powerhouse STMicroelectronics announced the availability of Version 3 of NanoEdge AI Studio, the first major upgrade of this software tool for machine-learning applications that ST acquired with Cartesiam earlier this year. The updates introduce new algorithms, better support for sensor data acquisition and management using an ST development board, and an enhanced user interface to make machine-learning implementation easier for embedded developers with no data-science skills.

Laird Connectivity and Packetcraft Launch New Bluetooth LE Audio Evaluation Kits for Connected Audio Applications

November 26, 2021 by Joao Martins

Laird Connectivity and Packetcraft Launch New Bluetooth LE Audio Evaluation Kits for Connected Audio Applications

Laird Connectivity partnered with Packetcraft to offer a complete Bluetooth LE Audio evaluation kit using Laird's BL5340 Bluetooth 5.2 development boards, a custom audio interface board, and Packetcraft’s comprehensive software solution for LE Audio. This development solution is ideal for developers looking to evaluate LE Audio for emerging next generation Bluetooth LE Audio applications, such as wireless microphones, broadcast audio for infrastructure, and much more.

DSP Concepts Partners with LG Electronics to Bring Voice Chat to the UltraGear Speaker

November 24, 2021 by audioXpress Staff

DSP Concepts Partners with LG Electronics to Bring Voice Chat to the UltraGear Speaker

DSP Concepts revealed its work with LG Electronics to develop the UltraGear Gaming Speaker (GP9), the first gaming speaker with built-in voice communication running Audio Weaver TalkTogether technology. Thanks to this implementation, the innovative LG GP9 design, which is also a complete, Hi-Res Audio certified, sound system, featuring a powerful USB-C audio interface with ESS DAC, is also able to deliver full-duplex, clear communication even during loud, intense gameplay, allowing for an improved, headset-free gaming experience.

Voicemod and Bragi Deliver Voice Modification and Effects Through Bragi OS

November 17, 2021 by Joao Martins

Voicemod and Bragi Deliver Voice Modification and Effects Through Bragi OS

Voicemod, a company from Valencia, Spain, specializing in voice effects and interactive voice modification experiences, is enabling Bragi’s new audio platform to incorporate voice modulation capabilities into smart earbuds and headsets for mobile, console, and handheld devices without tethering to a PC. The Voicemod-enabled B2B software solution integration with Bragi allows headphone OEMs to include untethered, hands-free, real-time voice augmentation features.

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

November 16, 2021 by Joao Martins

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

British chip company XMOS announced the launch of the XVF3610 and XVF3615 next generation voice processors. These high-performance two-mic voice interfaces for wireless speakers, TVs, set-top boxes, smart home appliances, gateway products and more, are built on the company's xcore.ai chip infrastructure, and are available in a cost-effective and easy-to-integrate package. XMOS also kick-started an alpha program for its all new ‘Avona’ voice reference design.

APEI Modeling and Measurement Session Details Development Using Poroacoustic Simulation

November 12, 2021 by Audio Engineering_Society

APEI Modeling and Measurement Session Details Development Using Poroacoustic Simulation

The AES Audio Product Education Institute (APEI) presents the third webinar on a series detailing the practice and benefits of simulation-driven audio developments. These APEI Modeling and Measurement sessions discuss the role of Digital Twins and how to influence fundamental design considerations, even before the first prototype is built to proof a concept. November 17, Ulrik Skov (Reality Labs at Meta) shares an actual project using a High Fidelity Poroacoustic Digital Twin.

Avnet Edge AI Development Kit Enables High Performance Edge Processing with Low-power On-chip Accelerators

November 9, 2021 by Cristina Costa

Avnet Edge AI Development Kit Enables High Performance Edge Processing with Low-power On-chip Accelerators

Avnet released a new development kit that features Avnet Embedded’s SMARC computing platform based on NXP’s i.MX.8M Plus, a 10.1-inch touch display, and a dual camera vision board supporting interchangeable IAS camera modules. The new development kit enables OEM design engineers to deploy autonomous artificial intelligence (AI) capabilities to embedded applications, thereby reducing or eliminating the dependency on cloud connectivity or processing.

xMEMS Announces Cowell Microspeaker for TWS and Hearing Aid Applications

November 2, 2021 by audioXpress Staff

xMEMS Announces Cowell Microspeaker for TWS and Hearing Aid Applications

xMEMS Labs today introduced Cowell, the world’s smallest monolithic MEMS µspeaker, targeting the replacement of balanced armature drivers in true wireless earbuds and hearing aid designs. At just 22mm3, 56 milligrams, and with a 3.2mm diameter side-firing package, Cowell delivers an impressive 110dB SPL at 1kHz. Cowell is the first speaker to use xMEMS’ 2nd generation M2 speaker cell architecture offering improved SPL/mm2 enabling increased loudness in smaller form factors.

Outline Announces Revamped ET Series Acoustic Measurement Turntables

November 1, 2021 by audioXpress Staff

Outline Announces Revamped ET Series Acoustic Measurement Turntables

A longstanding mainstay of Outline’s diverse portfolio of products, the company's ET System measurement turntables have received important new developments and refinements and are now available in two new models - ET50-3D and ET250R2-3D - to suit different speed and load requirements. Outline’s original concept of a high-precision, computer-controlled turntable capable of placing significant loads with perfect accuracy in a measurement environment is in daily use around the world.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

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