Exeger and Nordic Semiconductor Launch Powerfoyle Solar Shield for Nordic Thingy:91

Adding a Powerfoyle solar cell membrane to any low-power electronics is a great way to implement energy harvesting capabilities. An add-on Powerfoyle shield for the Nordic Semiconductor’s Thingy:91 enables developers to produce always-on designs in a fast and easy way. With this plug-and-play light energy harvesting innovation, Exeger has significantly expanded the possibilities of the prototyping platform and associated development boards for connected products.

imc Test & Measurement, a brand of Axiometrix Solutions, launched a new modular data acquisition system. The imc ARGUSfit base unit and additional amplifier and fieldbus interface modules, such as CAN FD, can simply be clicked together providing ultimate flexibility in vehicle and machine testing and monitoring. With this modularity, the imc ARGUSfit can be perfectly tailored to changing test environments, and the extremely compact size makes it ideal for applications in confined spaces.

STMicroelectronics and Sensory have announced a collaboration that will enable the STM32 microcontroller (MCU) user community to develop and prototype intuitive voice-based user interfaces for a wide range of smart embedded products. The STM32 MCUs pair with Sensory’s VoiceHub technology to streamline development of voice-based user interfaces on wearables, connected devices and smart home applications.

Dolby Laboratories and COMSOL join the Audio Product Education Institute in a discussion on the role of modeling and measurements in the loudspeaker design process. The webinar, June 16 (12pm EDT) shares speaker design project experiences, detailing how simulation, measurements, and experiments help in meeting projects' requirements. The use of simulation in audio system design and multiphysics modeling of loudspeakers is addressed.

Stratasys announced new material compatibility for its flagship J750 full color, multi-material 3D printing solution, delivering additional functionality and versatility for rapid prototyping and tooling applications. Stratasys new PolyJet Agilus30 rubber-like material and Digital ABS Plus engineering-grade material can now be used with the Stratasys J750 3D printer, expanding the range of applications that designers and manufacturers can 3D print

Loudspeaker design is not a trivial exercise, and as a result, high-performance acoustic simulation software is essential to get accurate predictions that help an engineer develop superior products. Demand for simulations at early design stages are increasing because cost and timing constraints make it impossible to prototype and test every design idea and much can be learned from simulation results, which cannot be obtained in the test chamber. Actran, MSC Software Company’s acoustic simulation solution, based on Finite Element Analysis (FEA) technology, provides predictive simulation capabilities to assess the vibro-acoustic performance of audio devices, which include speakers and microphones.

To house small PCBs using USB as the external power and signal interconnect, Hammond Manufacturing has extended its popular 1551 miniature family of IP54 ABS enclosures. This allows the development of USB powered products, leveraging the latest USB 3.1 10Gbits/s standard with generous internal room for PCBs. All versions feature a dedicated cut-out for a standard USB Type A plug in one end and have a recess in the lid for an inlay, label or HMI keypad.