PCB Piezotronics Adds Miniature ICP Triaxial Accelerometers with TEDS

PCB Piezotronics introduced new TLD356A01 and TLD356A03 Miniature ICP Triaxial Accelerometers with TEDS. These new models are upgrades to PCB's current 356A01 and 356A03 models with the addition of TEDS functionality. The new triaxial sensors are primarily used to measure vibration inside devices, where space is restricted and are highly valued for automotive systems development, modal and structural analysis, and general purpose vibration testing.

With the release of ArtemiS SUITE 12.5, HEAD acoustics introduced a complete structural analysis package, offering Time Domain Animation, Operational Deflection Shape (ODS), Shape Comparison Tool and Modal Analysis. This will allow a unified software environment for simulation and project engineers to address structural dynamic issues within the ArtemiS SUITE with ease and efficiency.

Once again, the 2017 COMSOL Conference in Boston brought together the COMSOL community. Attendees got a chance to test the latest features for COMSOL Multiphysics 5.3a and COMSOL Server, scheduled to be released in Q4 2017. New features include acoustics and acoustic-structure interactions based on a hybrid boundary element-finite element (BEM-FEM) method, impulse response for ray acoustics, magnetostatics, shape memory alloy (SMA) materials for structural analysis, and much more!