ALL NEWS ITEMS
Dirac Research Debuts Dirac Distortion Control, Enabling Cleaner Audio From Mobile Devices at MWC19
Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers
Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development
Expanded Perspectives on Loudspeaker Enclosure Materials with Voice Coil March 2019
Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019
Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables
DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture
Analogix Introduces Second Generation 10G USB-C Re-timer for Smartphones
Dirac Debuts Latest Version of Dirac 3D Audio at MWC19
HEAD acoustics Launches Acoustic Environment for Realistic Noise and Reverberation Measurements