Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

Nordic Semiconductor has revealed that Yinzida Technology, a consumer electronics manufacturer, has designed a 2.4GHz wireless audio transmission module that enables high fidelity wireless audio in applications such as microphones, musical instruments or audio headsets. This out-of-the-box, lossless and stable wireless audio solution is ideal for battery-powered designs with zero-delay DSP pipeline, using Nordic's nRF52832 SoC in both transmitter and receiver.

Nordic Semiconductor has used the latest trade shows globally to showcase its latest low power wireless solutions, and introduced a series of new development solutions targeting Bluetooth LE Audio. At the Embedded World Exhibition that took place in Nuremberg, Germany, Nordic offered demonstrations of its new nRF5340 Audio Development Kit (DK), a design platform for rapid development of LE Audio products, and the Nordic Thingy:53 a rapid prototyping solution, both based on Nordic’s nRF5340 SoC.

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Cypress Semiconductor announced two low-power, dual-mode Bluetooth 5.0 and Bluetooth Low Energy (BLE) microcontrollers (MCUs) that include support for Bluetooth mesh networking, and provide simultaneous Bluetooth 5.0 audio and BLE connections, delivering low-power wireless solutions that enable music and voice commands for battery-powered personal devices. With the new CYW20819 and CYW20820 MCUs, designers can also develop low-cost, low-power Bluetooth mesh network devices.

Cypress Semiconductor announced its single-chip solutions for the IoT applications are the world’s first to deliver Bluetooth mesh connectivity certified by the Bluetooth Special Interest Group (SIG) to a consumer product. Three Cypress wireless combo chips and the latest version of its Wireless Internet Connectivity for Embedded Devices (WICED) software development kit (SDK) support state-of-the-art Bluetooth connectivity with mesh networking capability.