All items tagged with connected devices (129)

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

February 9, 2022 by audioXpress Staff

More Than 5.5 Billion Smart Home Matter-Compliant Devices Forecasted to Ship Between 2022 and 2030

Still months from its completion, the Matter smart home specification is already driving new products and strategies across the smart home and consumer electronics market. With a host of major players, technology suppliers, and partners already pledged to delivering Matter compliant offerings, the specification is expected to dominate the smart home landscape within five years, according to a new report from market intelligence firm ABI Research.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

January 13, 2022 by Joao Martins

NXP Advances Matter Smart Home Connectivity with Industry’s First Secure Tri-Radio Device

NXP Semiconductors announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 (Zigbee, Thread, Z-Wave, Matter) protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases. The single SoC enables simultaneous transmit and receive for higher performance in smart solutions, and supports Matter, the new interoperable, secure connectivity standard for the smart home.

STMicroelectronics Upgrades NanoEdge AI Studio to Streamline Machine-Learning Software Development for Connected Devices

December 1, 2021 by audioXpress Staff

STMicroelectronics Upgrades NanoEdge AI Studio to Streamline Machine-Learning Software Development for Connected Devices

Global semiconductor powerhouse STMicroelectronics announced the availability of Version 3 of NanoEdge AI Studio, the first major upgrade of this software tool for machine-learning applications that ST acquired with Cartesiam earlier this year. The updates introduce new algorithms, better support for sensor data acquisition and management using an ST development board, and an enhanced user interface to make machine-learning implementation easier for embedded developers with no data-science skills.

ONsemi Expands Portfolio of Bluetooth LE Solutions With Innovative Smart Sensing Features

November 29, 2021 by Cristina Costa

ONsemi Expands Portfolio of Bluetooth LE Solutions With Innovative Smart Sensing Features

ONsemi (previously known as ON Semiconductor), a semiconductor manufacturer with a vast product portfolio of power, signal conditioning, interfaces, and sensing technologies, announced its new, secure RSL15 wireless microcontroller (MCU) that provides the industry’s lowest power consumption. Enabled with Bluetooth Low Energy 5.2 wireless connectivity, the RSL15 addresses the growing demand of connected applications requiring security without sacrificing power consumption.

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

November 9, 2021 by audioXpress Staff

NXP Introduces i.MX 93 Applications Processor Family for Secure Connected Devices with Edge AI

NXP Semiconductors is gradually catching up from the time the company wasted in the attempted merger with Qualcomm. The company announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart everything applications. The i.MX 93 family leverages a heterogenous multicore SoC architecture designed to leverage efficient edge machine learning.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Smart Speaker Shipments Surged to Record Levels

September 15, 2021 by audioXpress Staff

Smart Speaker Shipments Surged to Record Levels

The smart speaker market in the second quarter of 2021 surged to new heights as consumers and brands adapt to the ongoing pandemic, according to the latest research from Strategy Analytics. Even with the looming specters of supply chain challenges, component shortages, and the Delta variant of the COVID-19 virus hanging over the market, global shipments of smart speakers and smart displays in Q2 2021 grew 34.8% from Q2 2020 to 39.5 million units, a record for a second calendar quarter.

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

September 3, 2021 by Cristina Costa

World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

May 10, 2021 by audioXpress Staff

CEVA to Acquire Intrinsix to Offer Full Turnkey SoC Platforms

CEVA announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The acquisition allows CEVA to offer IP, software and chip development.

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