Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

On the opening day of Mobile World Congress (MWC) 2023 in Barcelona, OPPO announced a selection of flagship devices, new core connectivity products and technologies, as well as its latest R&D breakthroughs in chip technology. On the audio domain, OPPO promised to revolutionize the industry and leave Bluetooth limitations behind with its MariSilicon Y flagship audio SoC. A world first for Bluetooth wireless audio, the new SoC promises a 12Mbps data rate.

WiSA Technologies, a leading provider of wireless audio technologies for home theater already adopted by Bang & Olufsen, Harman, Klipsch, Savant, LG Electronics and many others, announced its first shipments of WiSA E development kits to leading audio brands developing multichannel audio systems. Using the 5GHz portion of the Wi-Fi band, WiSA E offers high-performance, high-quality wireless audio transmission and reception at an affordable price.

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

Knowles announced the availability of a new AI-enabled True Wireless Stereo (TWS) Development Platform that will certainly be welcomed by developers and manufacturers globally, looking to accelerate the product development process, from entry-level to premium applications. The new TWS development kit shortens the design cycle for OEMs, enabling advanced, differentiated products with contributed technology from Alango Technologies and Chatable, among others.

In early March 2021, following a series of announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high-resolution digital audio and enhanced voice communications across devices. The systems' approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers. But how can manufacturers and new brands benefit? Will there be a lossless extension for aptX Adaptive? We asked the questions to Jonny McClintock, Director of aptX Sales & Marketing at Qualcomm.

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.

Microchip announced a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec, extending availability of the high-resolution audio technology into mass market Bluetooth wireless products. Headphone manufacturer Audeze already implemented the new IS2064GM-0L3 SoC in its award-winning Mobius gaming headphones to create the best possible immersive Bluetooth audio experience today’s consumers demand.