All items tagged with smart speakers and development kit (11)

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

November 16, 2021 by Joao Martins

XMOS Strengthens Its Position In Voice Interfaces with XVF3610 and XVF3615 Voice Processors

British chip company XMOS announced the launch of the XVF3610 and XVF3615 next generation voice processors. These high-performance two-mic voice interfaces for wireless speakers, TVs, set-top boxes, smart home appliances, gateway products and more, are built on the company's xcore.ai chip infrastructure, and are available in a cost-effective and easy-to-integrate package. XMOS also kick-started an alpha program for its all new ‘Avona’ voice reference design.

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

June 7, 2021 by Cristina Costa

NXP Development Tools Support New Ultra-Wideband Applications With iPhone and Apple Watch

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app experiences.

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

February 24, 2021 by audioXpress Staff

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

Knowles Corporation, a leading provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, announced the AISonic Bluetooth Standard Solution, a complete development kit that enables fast voice integration to Bluetooth devices. The kit is built upon the Knowles AISonic Audio Edge Processor IA8201, a high-performance, ultra-low power audio-centric OpenDSP, and includes SDK, pre-integrated mics, and integration support for Bluetooth chips.

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

March 19, 2019 by audioXpress Staff

Qualcomm Launches AI-Enabled Highly Integrated SoCs and Dedicated Smart Speaker Platform

Qualcomm made two important announcements for audio developers, both bound to significantly impact the fast-growing market of smart speakers and new generation whole-home audio systems. The San Diego company announced the new QCS400 family of audio SoCs and the Smart Audio Platform 400 development kit, bringing smart speakers high-performance processing, Qualcomm AI Engine, superior connectivity, and multiple advanced audio and visual display capabilities in a single, power-optimized chip architecture.

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

January 10, 2019 by audioXpress Staff

Development Kit for Amazon AVS Supports Far-field Voice Interaction with Multiple Microphone Array Options

Microchip Technology, via its Microsemi Corporation subsidiary, announced that its AcuEdge ZLK38AVS Development Kit for Amazon Alexa Voice Service (AVS) now introduces far-field voice pick up and the flexibility to build devices with multiple mic array configurations. The audio front-end solution with one, two and three mic configurations reduces bill of materials costs while addressing the requirements of small-form-factor designs.

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

June 29, 2018 by audioXpress Staff

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

Wireless communications chipset solutions specialists DSP Group announced the availability of its HDClear 3-Microphone Development Kit for Amazon Alexa Voice Service (AVS). This Alexa certified solution features DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear voice enhancement processing technology, creating a complete development platform for low-power applications, including smart speakers, wearable computing devices, smart home devices and remote controls.

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

March 1, 2018 by Joao Martins

Qualcomm Introduces Smart Audio Platform and Speaker Development Kits for Multiple Voice Ecosystems

Following earlier demonstrations at CES 2018, Qualcomm introduced a series of new platforms, SoC and development kits targeting new advanced audio applications and smart speakers, including the support of key wireless technologies, voice and cloud ecosystems. Solutions include its Smart Audio Platform optimized for smart speakers, a 6-microphone far field voice platform qualified for Amazon AVS, Dolby Audio implementations for wireless speakers and much more.

XMOS Showcases Advanced True Stereo Voice Interface Solutions

February 1, 2018 by Joao Martins

XMOS Showcases Advanced True Stereo Voice Interface Solutions

XMOS will be showcasing their portfolio of far-field voice capture solutions for voice-enabled stereo smart TVs, soundbars, set-top boxes, and digital media adapter markets at GSMA Mobile World Congress 2018, Barcelona, 26th February to 1st March. XMOS will be demonstrating commercial solutions in development, and proof of concepts that capture voice commands accurately from across the room even when the audio appliances are playing content at high volume in complex noisy acoustic environments.

XMOS Announces First True-Stereo AEC Linear Voice Processor and Far-Field Voice Kit for Smart Devices

December 4, 2017 by audioXpress Staff

XMOS Announces First True-Stereo AEC Linear Voice Processor and Far-Field Voice Kit for Smart Devices

XMOS announced the XVF3500 voice processor which delivers 2-channel full duplex acoustic echo cancellation (AEC), along with the world’s first stereo AEC far-field linear microphone array solution, the VocalFusion Stereo Evaluation Kit (XK-VF3500-L33). The XVF3500 voice processor is designed for developers working in the growing voice-enabled smart TV, soundbar, set-top box, and digital media adapter markets, all of which require stereo-AEC support for “across the room” voice-interface solutions.

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

October 9, 2017 by audioXpress Staff

Infineon High SNR MEMS Microphones Complement Amazon AVS Far-Field Development Kit from XMOS

XMOS' VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications integrates Infineon’s high SNR MEMS microphones to ensure highest performance and reliability, creating the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables commands to be accurately captured from across the room for processing by the Alexa cloud-based speech recognition system.

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