TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Vesper, the pioneer in piezoelectric MEMS microphones and sensors, closed an $8M financing led by Applied Ventures, the venture capital arm of Applied Materials, the world’s largest semiconductor equipment company. Vesper also received investments from Accomplice, Amazon Alexa Fund, Bose Ventures, Sands Capital, and other undisclosed investors. The round brings Vesper's total funding to date to $65M. The funding will enable the Boston-based startup to scale the mass production of its microphones and support expanded research and development.

Qualcomm has released its annual The State of Play 2018 report, with valuable insights on the fast-moving world of personal and home audio technology - including expectations and product purchase drivers for American, British and Chinese consumers. The new report shows, for the second year in a row, that sound quality is by far the highest ranked buying consideration when choosing wireless headphones or speakers. More than half of participants surveyed (53%) said they are planning to purchase completely wire-free earbuds.