All items tagged with virtual reality (60)

Where Sound and Image Meet: AES New York 2017!

October 6, 2017 by Audio Engineering_Society

Where Sound and Image Meet: AES New York 2017!

The Audio Engineering Society New York 2017 convention will be co-located with the independent NAB Show New York 2017 event. In an adjacent exhibition hall, NAB Show New York exhibitors will be on hand with the latest video and distribution hardware and related sessions. Exhibits-Plus or All Access AES New York registration includes access to both exhibition halls. Naturally, the 143rd International AES Convention also features great content in audio for picture applications!

Sennheiser Launches “AMBEO for VR” Interoperability Partnership Program

September 18, 2017 by audioXpress Staff

Sennheiser Launches “AMBEO for VR” Interoperability Partnership Program

At IBC 2017, Sennheiser has officially announced its “AMBEO for VR” Partnership Program, which has been created to ensure seamless interoperable production workflows for VR and AR productions. The program encompasses collaborations with manufacturers of field recorders, VR live cameras and live streaming software, mixing plug-ins and VR platforms. The first participants in the program were revealed at the Amsterdam show.

Dirac Research Announces Appointments and New Investors to Accelerate Growth in VR/AR Applications and 3D Audio

April 24, 2017 by audioXpress Staff

Dirac Research Announces Appointments and New Investors to Accelerate Growth in VR/AR Applications and 3D Audio

Investing further in the build-out of its senior management team, Dirac Research appointed Lars Isaksson as Business Director of Augmented Reality/ Virtual Reality. The Swedish company also received extra support from new investors to, in part, accelerate its growth into the Virtual Reality and Augmented Reality markets. One of those investors, Jörgen Lantto, also joined Dirac’s Board of Directors. Meanwhile, the company was awarded a research grant from the Swedish government.

AES Technical Committee Group Formed to Explore Audio for New Realities

March 3, 2017 by Audio Engineering_Society

AES Technical Committee Group Formed to Explore Audio for New Realities

The Audio Engineering Society’s Technical Council (AESTC) has formed a new group to advance the science and application of Audio for New Realities. The group will serve the needs of the audio community working in Virtual, Augmented and Mixed Reality environments. “New realities” covers a whole gamut of application areas including film, games, music, communications, medicine, forensics, simulations, education and virtual tourism.

Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset

February 28, 2017 by audioXpress Staff

Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset

At Mobile World Congress 2017, Waves Audio and Realtek unveiled their co-developed WNX7000, the world's first integrated circuit (IC) with Waves Nx virtual reality audio technology embedded. The DSP specialists from Waves co-developed WNX7000 in partnership with Realtek Semiconductor, one of the world's leading network and multimedia IC providers, creating a high definition audio DSP chip embedded with Waves Nx technology. A complete Low Power DSP & Codec Hub audio solution with an integrated headphone amplifier.

Waves Nx VR and MaxxVoice Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

February 24, 2017 by audioXpress Staff

Waves Nx VR and MaxxVoice Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

Cadence Design Systems and Waves Audio announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence Tensilica HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in Hall 6, Stand 6L36.

Facebook Unveils Technology Behind Audio 360 Virtual Reality Experience

February 23, 2017 by audioXpress Staff

Facebook Unveils Technology Behind Audio 360 Virtual Reality Experience

First announced in Q4 2016, Facebook's 360 audio technology was discussed for the first time at Video@Scale, an invitation-only technical conference for engineers who work on large-scale video platforms and technologies. During the event, Facebook revealed more details of its new spatial audio encoding and rendering technology, using "hybrid higher-order ambisonics," and supporting head-locked audio for virtual reality applications.

Dirac Promises Major Product Introductions At Mobile World Congress 2017

February 22, 2017 by audioXpress Staff

Dirac Promises Major Product Introductions At Mobile World Congress 2017

Sound optimization technology experts Dirac Research announced the introduction of two new audio solutions that help transform nearly any mobile device and headphone into an on-the-go home theatre. The two solutions — the brand new Dirac VR and a second-generation Dirac Panorama Sound — will be formally unveiled and demonstrated at Mobile World Congress (MWC) 2017.

Dirac Research Achieves Major Breakthrough In 3D Audio With Dynamic HRTF Technology for AR/VR Applications

December 12, 2016 by audioXpress Staff

Dirac Research Achieves Major Breakthrough In 3D Audio With Dynamic HRTF Technology for AR/VR Applications

At CES 2017, Dirac will introduce the world to its Dynamic 3D Audio solution featuring patent-pending Dynamic HRTFs (head-related transfer functions) that crack the code of the industry’s foremost challenges. The Swedish company, one of the world’s leading digital audio processing and sound enhancement specialists, says its Dynamic 3D Audio platform removes a major barrier to a truly convincing immersive AR/VR experience.

Freedman Electronics Group Acquires Soundfield From TSL Products

November 21, 2016 by audioXpress Staff

Freedman Electronics Group Acquires Soundfield From TSL Products

On the eve of its 50th year in business, The Freedman Electronics Group, home to pro audio brands RØDE Microphones, Event Electronics and Aphex, expanded its company portfolio, purchasing the surround sound recording SoundField range of products and technology from broadcast equipment manufacturer TSL Products. With this acquisition, RØDE gains access to the leading brand in surround production and Ambisonic audio, in the exact moment when the format is gaining momentum.

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