Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

Cadence Design Systems announced the Cadence Tensilica HiFi 5 DSP for audio and voice, the company's first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.

Sensory, the originator of wake words for personal assistants, raised the performance bar for always-listening wake word and speech recognition with significant upgrades to the embedded AI in its sixth generation of TrulyHandsfree, boosting the technology's already industry-leading wake word performance and accuracy by more than 65 percent. The new solution introduces upgraded turn-key voice interface solutions for devices of all shapes, sizes and power requirements.

Voice UI chipset specialist DSP Group, and Harman International, a wholly-owned subsidiary of Samsung Electronics, announced their cooperation implementing voice input technology, based on DSP Group’s SmartVoice Audio/voice SoC and HDClear far-field multi-mic algorithms. The cooperation will enable expanding Harman's Sonique Total Voice Solution platform into a new generation of voice-enabled products.

XMOS' VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications integrates Infineon’s high SNR MEMS microphones to ensure highest performance and reliability, creating the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables commands to be accurately captured from across the room for processing by the Alexa cloud-based speech recognition system.

In previous editorials, I have highlighted the important role of smart speakers in promoting the user case for voice personal assistants (VPAs) and voice recognition applications - given the ideal combination of far-field microphone arrays with a complete audio ecosystem that encompasses digital signal processing, acoustic echo cancelation, noise cancellation, and many other technologies. This opens significant opportunities for the audio industry, given we understand the challenges.

Apple's opening keynote for its Worldwide Developers Conference 2017 (WWDC17) at the San Jose McEnery Convention Center, was a swirl of long expected announcements, wrapped in surprising underlying technology revelations. Among the many announcements was the preview of Apple's new home music speaker with built-in-far-field voice recognition powered by Apple Siri, the HomePod. As expected, the design is a powerful combination of electroacoustic mastery, digital processing and smart connectivity.