Infineon and XMOS Cooperate on New Voice-Recognition Platform that Combines Radar with MEMS Microphones and Audio Processing

At Mobile World Congress 2017, Barcelona, Infineon Technologies and XMOS partner to deliver a new building block for voice recognition. It features a combination of Infineon’s BGT60TR24B 60GHz 2Tx/4Rx radar IC with accompanying antenna, 70dB SNR silicon microphone sensors, based on Infineon’s dual backplate MEMS technology, and an audio processor from XMOS. In combination, the solution provides far field voice capture by audio beamforming combined with radar target presence detection.

Top MEMS supplier STMicroelectronics, DSP Group, and Sensory, a leading technology provider of voice interface and keyword-detect algorithms, have revealed details for a highly power-efficient, voice-detecting and -processing microphone that delivers keyword-recognition capabilities in a compact package. Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.

Speech and audio quality specialists, HEAD acoustics GmbH from Herzogenrath, Germany, will be presenting its range of solutions at the Mobile World Congress (​​February 27 to March 2, 2017). Like many key development technology companies, HEAD acoustics will use the Barcelona show to demonstrate a new evaluation software of VoCAS (Voice Control Analysis System), as well as an update of its communication analysis software ACQUA 3.5.100.