Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

CEVA announced that its RivieraWaves Bluetooth Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification. Supporting both the widely adopted Bluetooth Classic Audio and the latest features for the next generation Bluetooth LE Audio, licensees can use the RivieraWaves Bluetooth Dual Mode 5.2 Platform to leap ahead with their next-generation designs for TWS earbuds, smart watches, smart speakers and other Bluetooth-enabled audio products.

CEVA, a licensor of signal processing platforms and artificial intelligence processors for connected devices, reinforced its leadership in the Bluetooth IP market with delivery of its RivieraWaves Bluetooth 5 dual mode IP to multiple licensees, including ASR Microelectronics, a fabless semiconductor company. ASR Micro adopted RivieraWaves Bluetooth 5 Dual Mode IP for smartphones, smart speakers, headsets and IoT Devices.