HEAD acoustics ViBRIDGE: Holistic Testing of In-Ear Headsets with Bone Conduction Sensors

With the availability of the HEL/HER 4.4 ViBRIDGE Flexible Pinna for HMS II.3/5, the industry as gained a vital testing tool for in-ear headset designs that utilize bone conduction sensors. Evaluating these systems is vital to optimize near-end structure-borne sound to improve speech quality in the presence of background noise, improve echo cancellation, and double-talk performance. The unique technology developed by HEAD acoustics is being enthusiastically embraced by the industry.

EarFun has launched the new Air Pro 3 true wireless earbuds that are said to be LE Audio-ready. audioXpress has waited until the start of MWC 2023 in Barcelona to see if anyone would dispute or make a similar claim. Since no one did, we can reliably publish the story now. Earfun is now selling the World's 1st LE-audio ANC true wireless earbuds, the brand's new TWS earbud flagship, which uses the Qualcomm QCC 3071 chip, and also supports Bluetooth 5.3, and aptX Adaptive.

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.

CEVA, a leading licensor of signal processing platforms for smart, connected devices, introduced ClearVox, a new software suite of advanced voice input processing algorithms aimed at enhancing speech intelligibility and voice clarity for voice-enabled devices. ClearVox is licensed exclusively for the CEVA-TeakLite-4 and CEVA-X2 audio/voice DSPs, and extends the company’s voice portfolio with multi-mic beamforming, speaker direction of arrival, noise suppression and echo cancellation algorithms.