All items tagged with product development (878)

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

January 18, 2023 by audioXpress Staff

Infineon Announces Partner Ecosystem for Latest MERUS Multilevel Class-D Audio Amplifier Technology

Infineon Technologies recently introduced its latest generation of MERUS multilevel Class-D audio amplifiers, and now the company announced new ecosystem partners that are ready to support interested developers and manufacturers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of these new amplifiers with a unique Class D modulation of up to 5 different output voltage levels.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

January 13, 2023 by Joao Martins

Knowles Debuts Trio of SiSonic MEMS Microphones for High-Performance TWS and Hearable Designs

Knowles introduced its latest series of SiSonic MEMS microphones at CES 2023. The new Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog) are a new trio of microphones providing advanced performance capabilities for space constrained ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses and Virtual Reality (VR) headsets.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

January 6, 2023 by Joao Martins

GaN Systems and Axign Unveil 1000W Class-D Heatsinkless Audio Amplifier Design

GaN power semiconductors pioneer GaN Systems has once again teamed up with Dutch company Axign to unveil an even more powerful, 1000W Class-D GaN audio amplifier board at CES 2023. The new reference design merges best-in-class technologies from GaN Systems and Axign to enable unique audio systems that are smaller, more efficient, and offer better audio quality. The design is ideal for automotive, professional, and prosumer audio applications.

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

January 3, 2023 by Joao Martins

Nordic Semiconductor Selects Packetcraft Controller Software Delivering Advanced Bluetooth LE Audio Capability

Packetcraft, a leading provider of Bluetooth embedded stacks and software solutions, announced their Bluetooth Qualified LE Controller is shipping with Nordic Semiconductor’s flagship nRF5340 dual-core Bluetooth 5.3 SoC enabling LE Audio in commercial products. At CES 2023, Packetcraft is already showcasing Bluetooth LE Audio and Auracast broadcast audio applications using Nordic’s nRF5340 SoC, including from Sonical, EMSi and Fanstel.

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

December 21, 2022 by audioXpress Staff

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

Femtosense announced the arrival and successful testing of its first silicon, substantiating the startup’s assertions that it will deliver significantly more efficient, lower cost and real-time AI processing for valuable and affordable consumer electronics. At CES 2023, the Edge AI company will demonstrate compelling audio applications with highly efficient, real-time artificial intelligence (AI) processing with low power, low cost requirements.

StreamUnlimited Showcases Matter Functionality at CES 2023

December 20, 2022 by audioXpress Staff

StreamUnlimited Showcases Matter Functionality at CES 2023

StreamUnlimited will attend CES 2023, promoting itself as the Matter System Integrator. With the strong momentum in the industry about the evolution of smart home solutions benefiting from Matter functionality, at CES 2023 the company will demonstrate the latest systems integrations as part of its StreamThings software stack. Matter, the highly anticipated standard for interoperable connectivity within the IoT space, has been a popular request from StreamUnlimited partners.

FORCE Technology Partners with Sound Hub Denmark to Support Sound Quality Testing

December 14, 2022 by audioXpress Staff

FORCE Technology Partners with Sound Hub Denmark to Support Sound Quality Testing

FORCE Technology, a large technology consultancy and service company and one of the large certification institutes in Denmark, providing on-site inspections, measurements, and calibration laboratories, established a partnership on product sound quality testing with Sound Hub Denmark. The goal is to reinforce the work of the many audio companies that are already using the resources offered by the Sound Hub, while also expanding the range of services available.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

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