All items tagged with Cadence Design Systems (15)

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

March 10, 2023 by audioXpress Staff

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

Want to understand what's ahead in the most revolutionary audio product category of the 21st century? Read the State of the Hearables Industry Market Update. And for product developers and manufacturers, there's also a Headphones Test and Measurement report. Burkhard Vogel discusses op-amp noise in simulated models, Bruce E. Gillingham offers a complete monoblock power amplifier project, and René Christensen writes about acoustic topology optimization. And so much more....

Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos in Cars

January 9, 2023 by audioXpress Staff

Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos in Cars

Cadence Design Systems announced that its Tensilica HiFi DSP now supports Dolby Atmos for cars, making it the first DSP IP with this capability. Cadence has optimized the Dolby car experience technology to run on the Tensilica HiFi DSP for audio playback of Dolby Atmos for cars. Offloading Dolby Atmos to the low-energy, high-performance Tensilica HiFi DSP enables system-on-chip (SoC) providers to offer automotive OEMs and Tier 1 suppliers a more energy-efficient implementation without affecting the audio experience.

Cadence and Dassault Systèmes Partner on Electronic Systems Development

February 23, 2022 by Joao Martins

Cadence and Dassault Systèmes Partner on Electronic Systems Development

A partnership between Cadence and Dassault Systèmes intends to leverage the Cadence Allegro platform and the 3DExperience SolidWorks CAD software platform to optimize electromechanical systems modeling, design, simulation and product lifecycle management. The two companies are determined to accelerate innovation and time-to-product realization by improving modeling, simulation, virtual twin experiences, collaboration, manufacturing and supply chain execution.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

September 10, 2021 by audioXpress Staff

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

Rohde & Schwarz and Cadence Design Systems have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and enhancing accuracy by using realistic signals for both simulation and testing. The new R&S VSESIM-VSS signal creation and analysis tool speeds up the development process for RF components and is particularly useful manufacturers of active components and systems.

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

June 18, 2021 by audioXpress Staff

Cadence Announces New Tensilica FloatingPoint DSP Family for Low Power AI/ML

Cadence Design Systems unveiled the Cadence Tensilica FloatingPoint DSP family, optimized for power, performance and area (PPA). The new DSP IP cores extend from small, ultra-low power to very high performance and are well-suited for a broad array of applications, from energy-efficient solutions for battery powered devices to artificial intelligence/machine learning (AI/ML), sensor fusion, object tracking and augmented reality applications in the mobile, automotive, and consumer markets.

May 17, 2021 by audioXpress Staff

Cadence Offers MPEG-H 3D Audio Baseline Profile Decoders for Tensilica HiFi DSPs

Fraunhofer confirmed that Cadence Design Systems is now offering decoder implementations supporting the new MPEG-H 3D Audio Baseline Profile and has joined the MPEG-H Audio System trademark program administered by Fraunhofer. Adding MPEG-H 3D Audio Baseline Profile decoding capabilities to Cadence’s industry-leading Tensilica HiFi DSP designs opens up the potential to bring interactive and immersive sound to millions of users worldwide.

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

April 26, 2021 by audioXpress Staff

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

Cadence Design Systems expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for demanding and always-on AI applications. The Tensilica Vision P1 DSP is optimized for always-on and smart sensor applications in the consumer market, providing an energy-efficient solution. Packing an industry-leading 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers 2X performance and memory bandwidth compared to the Tensilica Vision Q7 DSP.

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

March 31, 2021 by audioXpress Staff

Elliptic Labs Optimizes Its Advanced Virtual Sensors for Cadence Tensilica HiFi DSPs

Elliptic Labs, the Norwegian software sensor technology company, announced a collaboration with Cadence Design Systems to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs. Enabling Elliptic Labs to expand its software sensor user interfaces to more embedded systems, while simultaneously reducing power consumption for energy-critical applications, this collaboration benefits manufacturers in a wide range of markets, including mobile consumer devices, and automotive.

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

February 28, 2020 by audioXpress Staff

Cadence Announces Industry’s First Verification IP for PHY Covering Multiple Protocols

Cadence Design Systems announced the availability of the industry’s first Verification IP (VIP) that enables comprehensive and fast verification of the physical layer (PHY) for complex protocols such as PCIe 5.0, USB3/4, DDR5, LPDDR5, HBM and MIPI CSI-2 and DSI 2.0. This allows companies to thoroughly test and optimize their PHY designs, accelerating development.

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