Everything That's Audio in audioXpress December 2023

audioXpress December 2023 includes a market overview of multiroom audio, Brent Butterworth writes about new ways to measure ANC earbuds, and Stuart Yaniger measured the new Axign and GaN Systems Class-D audio amplifier board. Richard Honeycutt writes about tubes, BJTs, JFETs, MOSFETs, and ICs, and Dimitri Danyuk, discusses JFETs in audio circuits. Douglas Self explains how to optimize variable-frequency tone controls, and Jan Didden shares his eDD direct-drive amplifier project.

With the availability of the HEL/HER 4.4 ViBRIDGE Flexible Pinna for HMS II.3/5, the industry as gained a vital testing tool for in-ear headset designs that utilize bone conduction sensors. Evaluating these systems is vital to optimize near-end structure-borne sound to improve speech quality in the presence of background noise, improve echo cancellation, and double-talk performance. The unique technology developed by HEAD acoustics is being enthusiastically embraced by the industry.

As many audioXpress readers already learned from reading the article by Hans W. Gierlich on the Benefits of Using Structure-Borne Sound in Headset Signal Processing, HEAD acoustics created a complete test solution for in-ear and headset devices using bone-conduction sensors. There are good reasons for developers and manufacturers to explore the use of bone-conduction sensors and test them with the new ViBRIDGE solution.

SoundChip SA, a Swiss-based global leader in hearable sound technology, announced the introduction of its Waypoints platform, which combines proven methods, tools and expertise to help manufacturers scale the delivery of effective noise cancelling into more products within their headset portfolio than ever before. The new platform supports third-party NC chips in addition to SoundChip's own HD-PA devices.